ESD Foam

January 31,2019

Features of ESD Foam

ESD packing foam is commonly used in industries such as electronics manufacturing, aerospace, medical devices, telecommunications, and any other field where electrostatic discharge protection is critical. It provides a reliable and protective packaging solution to safeguard sensitive electronic components from static electricity-related damage.

1. It promotes the rapid release of electrostatic without using the environmental humidity.
2. Buffer good performance.
3. Excellent electrical conductivity, suface reistance: 103-109 Ω;
4. High temperature resistance: EVA maximum temperature 120℃;
5. Chemical resistance: resistant to organic solvents, acids, bases, etc.;
6. No chemical corrosion: It has no corrosion to the components and packaging;
7. Heat insulation, sound insulation, water absorption, moisture;
8. Good processing performance, easy molding.