item No :
Thickness: 3,4,5,6,8,10,12,15,20mmSize: 1020 x 1220 mm/1220 x 2440 mm
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Thickness
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3,4,5,6,8,10,12,15,20mm
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Size
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1020 x 1220 mm/1220 x 2440 mm
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Material
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Fiberglass mat, epoxy resin
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Density
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1.95g/cm3
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Surface Resistance
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10^6-10^9 ohm
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Rated Voltage
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200V
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Durostone Anti-Static Composite Material for Wave and Reflow Soldering Process
It is designed and developed from glass fiber and resin compound mainly for the different needs of the circuit board mounting process.
It can be machined to the precision required by each process and maintain its flatness during continuous use. The low thermal conductivity of the material can prevent the substrate from shrinking. Ensure the quality of reflow.
